| 标题：环球机器参数 |
Model GSMx
General Package styles placed SOIC, PLCC, TSOP, QFP, BGA, TAB, Flip chip, Odd form, COB, Die, Melf, Through hole, SOT, SOJ, SMM, MCM, DMM, Shields, Passives, Sockets, Crystals, POTS, Resistor Arrays, Dpak, LCC, Coils, CSP, CGA, microBGA
"Board size
capability" Maximum size (inches) 457.2 mm x 508 mm
Minimum size (inches) 27 mm x 50.8 mm
Maximum thickness (") 13 mm
Minimum thickness (") 0.25 mm
Maximum warpage (") ANSI/IPC-300G
Comp. Handling Centering type Optical, programmable force
"Programmable
placement force" Yes
Feeder info. Part feeder types Tape/Tube/Tray/Bulk/ Waffle/Surf Tape/ GPAX/Wager
Max. number 8 mm 168
Max. number 12 mm 168
Max. number 16 mm 84
Max. number 24 mm 84
Max. number 32 mm 56
Max. number 56 mm 42
Other sizes 44, 72, 88, 104, 120
Max. number of tubes Single tube(208), 40 mm (32), 50 mm (21), 60 mm (16)
Tray changer Yes
Speed "Rated speed/cycle time:
0402-1206 chips(w/adhes.)" 4.700 cph
"Rated speed/cycle time:
0402-1206 chips(w/o adhes.)" 4,700 cph
"Rated speed/cycle time:
SOICs and PLCCs" 4,700 cph
"Rated speed/cycle time:
256 I/O BGA" 4,700 cph
"Rated speed/cycle time:
208 I/O 5-mil fine-pitch QFP" 4,700 cph
Movement during placement Head
Placement head Type Various
Resolution (X, Y) 0.001 mm
Repeatability (X, Y) < 0.004 mm
Adhesive plcmnt. Integrated Yes
Board handling Optical alignment Yes
Board held by Edge clamp
Fiducials supported Yes
How many types? All
Conveyor: optional standard Opt.
Board movement R to L, R to L
Program CAD download Yes
Off-line programming? Yes |
| 回答问题 |
| 好东西就不要让他沉下去 |
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| 不错,有点收获 |
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| 你的收获是我们最大的褒奖！ [s:1] |
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| 好,顶一下 [s:1] [s:1] [s:1] [s:1] |
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| GSM和GSMX参数有区别吗？ |
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